Brief: Discover the Rogers Fr4 10 Layer Pcb Stackup Multilayer PCB Design, perfect for power amplifier applications. This high-frequency PCB features a mix of FR4 and Rogers materials, ensuring superior signal integrity and performance. Ideal for wireless communication, radar systems, and high-speed data transmission.
Related Product Features:
10-layer multilayer PCB design optimized for power amplifiers.
Combines FR4 and Rogers materials for enhanced performance.
Copper thickness options from 0.5-6OZ for versatile applications.
L'épaisseur du panneau varie de 0,2 à 7,0 mm pour répondre à divers besoins.
Taille minimale des trous de 0,15 mm et largeur de ligne de 0,075 mm pour la précision.
Surface finishing options include ENIG, HASL, and OSP.
Available in multiple soldermask and silkscreen colors.
Certified with UL, ROHS, and ISO9001 for quality assurance.
Les questions:
What materials are used in the Rogers Fr4 10 Layer Pcb Stackup?
The PCB uses a mix of FR4 and Rogers materials, known for their low dielectric constant and low dissipation factor, ensuring high-frequency performance.
What are the lead times for this PCB?
Lead times vary by layer count, ranging from 2 workdays for 1-2 layers to at least 18 workdays for 18-40 layers. HDI and blind/buried hole PCBs require an additional 3 workdays.
How can I get a quick quotation for this PCB?
Send your Gerber file or provide details like board material, thickness, copper thickness, surface treatment, and quantity. If no Gerber file is available, you can send your PCB for cloning.