BGA PCB services d'assemblage de circuits imprimés fabricant de processus en Chine

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BGA PCB services d'assemblage de circuits imprimés fabricant de processus en Chine

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May 17, 2024

Category Connection: Assemblée de carte PCB

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Quality Assemblée de carte PCB de la Chine https://www.hdiflexpcb.com/videos-44068542-bga-pcb-printed-circuit-board-assembly-services-process-manufacturer-in-china.html
ONESEINE TECHNOLOGY CO.,LTD quality manufacturer from China.
We can supply:
carte PCB de câble : https://www.hdiflexpcb.com/supplier-4434815-flex-pcb
PCB de Rogers : https://www.hdiflexpcb.com/supplier-4434818-rogers-pcb
Carte PCB à haute fréquence : https://www.hdiflexpcb.com/supplier-4434822-high-frequency-pcb
Welcome to visit our official website : https://www.hdiflexpcb.com

Les étiquettes:

#Prototype de PCBway #ensemble de carte PCB de bas volume #Service d'Assemblée de carte PCB

Brief: Discover the advanced BGA PCB Printed Circuit Board Assembly Services Process in China. Our high-density, high-performance BGA PCBs feature immersion gold finish, precise testing, and superior thermal conductivity for optimal electronic performance.

Related Product Features:

Material: Fr4 1.6mm with 6 layers for durability and reliability.
Surface finish: Immersion gold for enhanced conductivity and corrosion resistance.
Poids du cuivre : 70 UM garantissant de solides performances électriques.
Assembly components: IC chips with 484 footprint for high-density integration.
Testing: X-Ray inspection for quality assurance.
Min line width and space: 3mil for precision and compact design.
Solder mask and silkscreen included for protection and labeling.
La technologie d'encapsulation BGA offre des propriétés thermiques et électriques supérieures.

Les questions:

What is BGA packaging technology?

BGA (Ball Grid Array) is a high-density surface mount packaging technology with spherical pins arranged in a lattice pattern, offering better thermal and electrical performance compared to traditional packages.
Quels sont les avantages des PCB BGA?

Les PCB BGA offrent une densité élevée, une conductivité thermique supérieure et des conduits à faible inductance, ce qui les rend idéaux pour les circuits électroniques à grande vitesse et les conceptions compactes.
How is the BGA PCB assembly process conducted?

The process includes component procurement, PCB fabrication, precise component placement using pick-and-place machines, soldering (reflow or wave), inspection, testing, and final assembly to ensure quality and functionality.